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    Home ? Product Center ? Other ? Bare Die/Wafer ? LM5025A Die  ? 
    

    
    
    
        
    
    
    
    
        A wafer, also called a slice or substrate, is a thin slice of semiconductor material, such as a crystalline silicon, used in electronics for the fabrication of integrated circuits and in photovoltaics for conventional, wafer-based solar cells. The wafer serves as the substrate for microelectronic devices built in and over the wafer and undergoes many microfabrication process steps such as doping or ion implantation, etching, deposition of various materials, and photolithographic patterning. Finally the individual microcircuits are separated (dicing) and packaged.    
    

    

    
    

    

    
    
    

	
    
	
	
    
	    		
	 
	 
	
    
	
    
	
	
    LM5025A Die 
    
	    		
	 
	
    
	
    
	Active Clamp Voltage Mode PWM Controller
	 
	
    
    

    

    
DIE/WAFER CHARACTERISTICS
    

    

	
    
	Fabrication Attributes
	General Die Information
	
	
    
	
    
	 Physical Die
    
	 Identification    		
	 LM5025A
	 Bond Pad Opening   Size  (min)
	 91μm x 91μm
	
    
	
    
	 Die Step
	 A
	 Bond Pad Metalization
	 Al_ 0.5%Cu
	
    
	
    
	Physical Attributes
	 Passivation
	 PECVDOX+NITRIDE
	
    
	
    
	 Wafer Diameter
	 150mm
	 Back Side Metal
	 BARE BACK
	
    
	
    
	 Die Size (Drawn)
	 2286μm x 2540μm         90.0mils x 100.0mils
	 Back Side Connection
	 Floating
	
    
	
    
	 Thickness
	 254μm Nominal
	 
	
    
	
    
	 Min Pitch
	 167μm Nominal
	 
	
    
	
    
	Special Assembly Requirements:
	
    
	
    
	Note: Actual die size is rounded to the nearest micron.
	
    
	
    
	 
	
    
	
    
	    LM5025 MDC MWC
    
	    ACTIVE CLAMP VOLTAGE MODE PWM CONTROLLER
    
	                          LM5025A Die封裝圖    		
	
    
    

    

     
    

    
                    
    








    
	
     
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